Adafruit_STHS34PF80/sths34pf80.txt

STHS34PF80
Datasheet

Low-power, high-sensitivity infrared (IR) sensor for presence and motion detection
Features
Key features
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Product status link
STHS34PF80

Product summary
Order code

STHS34PF80TR

Temperature
range [°C]

-40 to +85

Package

LGA-10L

Packing

Tape and reel

Product resources

High-sensitivity infrared presence and motion detection sensor
Reach up to 4 meters without lens for objects measuring 70 x 25 cm²
Integrated silicon IR filter
SMD friendly
Capable of detecting stationary objects
Capable of distinguishing between stationary and moving objects
80° field of view
Factory calibrated
Low power
Embedded smart algorithm for presence / motion detection

Electrical specifications
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Supply voltage: 1.7 V to 3.6 V
Supply current: 10 µA
2-wire I²C / 3-wire SPI serial interface
Programmable ODRs from 0.25 Hz to 30 Hz
One-shot mode

Sensing specifications
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IR sensitivity: 2000 LSB/°C
RMS noise: 25 LSBrms

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Operating wavelength: 5 µm to 20 µm
Local temperature sensor accuracy: ±0.3 °C

AN5867 (device application note)
TN0018 (design and soldering)

Product label

Package specifications
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LGA 10-lead, 3.2 x 4.2 x 1.455 (max) mm
ECOPACK and RoHS compliant

Applications
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Presence and proximity sensing
Alarm / security systems
Home automation
Smart lighting
IoT
Smart lockers
Smart wall pads

DS13916 - Rev 2 - July 2023
For further information contact your local STMicroelectronics sales office.

www.st.com

STHS34PF80

Description
The STHS34PF80 is an uncooled, factory-calibrated, infrared motion and presence detection sensor with
operating wavelength between 5 µm and 20 µm.
The STHS34PF80 sensor has been designed to measure the amount of IR radiation emitted from an object within
its field of view. The information is digitally processed by the ASIC, which can be programmed to monitor motion,
presence, or an overtemperature condition.
Thanks to its exceptional sensitivity, the STHS34PF80 can detect the presence of a human being at a distance up
to 4 meters without the need of an optical lens.
The STHS34PF80 is housed in a small 3.2 x 4.2 x 1.455 (max) mm 10-lead LGA package.

DS13916 - Rev 2

page 2/40

STHS34PF80
Overview

1

Overview
The STHS34PF80 is an infrared sensor that can be used to detect the presence of stationary and moving objects
as well as overtemperature conditions. It measures the object's IR radiation with unique TMOS technology to
detect its presence or motion when the object is inside the field of view.
An optical band-pass filter is deposited over the sensor limiting its operating range within the wavelengths of 5 µm
to 20 µm, making it insensitive to visible light and other bands.
The sensor is based on a matrix of floating vacuum thermal transistors MOS (TMOS) connected together and
acting as a single sensing element. A state-of-the-art thermal isolation is achieved thanks to ST's unique MEMS
manufacturing technologies, allowing the sensor to translate the smallest temperature changes into electrical
signals that, in turn, are fed to the ASIC.
The sensor is split into two parts, one exposed to IR radiation and the other one shielded. Differential reading
between the two parts is implemented to remove the effect of sensor self-heating.
The STHS34PF80 embeds a high-accuracy temperature sensor to measure the ambient temperature and to
enable measuring the precise IR radiation of an object.
The ASIC also implements dedicated smart processing to detect / discriminate between stationary and moving
objects and which can assert dedicated interrupts.
Different ODRs from 0.25 Hz to 30 Hz and a one-shot mode are available.
The STHS34PF80 is equipped with an I²C / 3-wire SPI interface and is housed in an OLGA 3.2 x 4.2 x 1.455 mm
10L package compatible with SMD mounting.
The field of view guaranteed by the package is 80°.
Figure 1. Block diagram

TMOS
Sensor

TMOS Analog
Front
End

ADC1

Temperature
Sensor

ADC2

Power
management

DS13916 - Rev 2

Digital
Logic
(Registers / LPF
etc..)

Clock generator

I2C
SPI
Digital Interface

Interrupt

Voltage &
Current bias

CS
SCL/SPC
SDA/SDI/O

INT

Calibration
registers

page 3/40

STHS34PF80
Pin description

2

Pin description
Figure 2. Pin configuration (package bottom view)

Table 1. Pin description

DS13916 - Rev 2

Pin number

Name

1

SCL / SPC

2

RES

3

CS

4

SDA / SDI/O

5

NC

6

VDD

Power supply

7

GND

0 V supply

8

GND

0 V supply

9

VDD

Power supply

10

INT

Interrupt signal

Function
I²C / SPI serial interface clock
Reserved (connect to GND)
I²C / SPI interface selection (1: I²C enabled; 0: SPI enabled)
I²C / SPI serial data line
Leave floating (do not connect)

page 4/40

STHS34PF80
Sensor and electrical specifications

3

Sensor and electrical specifications
Conditions at VDD = 1.8 V, T = 25 °C.
Table 2. Sensor specifications
Min.

Typ.(1)

Max.

Unit

Temperature output data (object and ambient)

–

16

–

Bit

Tamb_s

Ambient temperature sensitivity

–

100

–

LSB/°C

Tobj_s

Object temperature sensitivity(2)

Tamb_a

Ambient temperature sensor accuracy

Symbol

Parameter

Tbit

ODR

Object and ambient temperature output data rate

RMS noise
FFOV

Test condition

15 °C to 35 °C

2000

-10 °C to 60 °C

±0.3

-40 °C to 85 °C

±0.6

ODR [3:0] = 0001

0.25

ODR [3:0] = 0010

0.5

ODR [3:0] = 0011

1.0

ODR [3:0] = 0100

2.0

ODR [3:0] = 0101

4.0

ODR [3:0] = 0110

8.0

ODR [3:0] = 0111

15.0

ODR [3:0] = 1xxx

30.0

LSB/°C
°C

Hz

AVG_TMOS = 32(3)

25

LSBrms

Full field of view(4)

80

Degree

1. Typical specifications are not guaranteed.
2. The object temperature sensitivity is specified for full field-of-view coverage by a blackbody with more than 99% emissivity
and default gain mode configuration (CTRL0 (17h)). The accuracy specifications apply under settled isothermal conditions
only.
3. Tobj RMS noise can be different based on the AVG_TMOS value. Further detailed information can be found in Table 19.
4. Angle to have 50% IR intensity.

Table 3. Electrical specifications
Symbol

Parameter

VDD

Supply voltage

IDD

Supply current

IddPDN
TOP

Test condition

Min.

Typ.(1)

Max.

Unit

1.7

–

3.6

V

128 average @ 1 Hz ODR

10

32 average @ 1 Hz ODR

5

Power-down supply current
Operating temperature range (refer to Table 5)

µA

1.5
-40

–

µA
85

°C

1. Typical specifications are not guaranteed.

DS13916 - Rev 2

page 5/40

STHS34PF80
Sensor and electrical specifications

Table 4. DC characteristics
Symbol

Parameter

Condition

Min.

Typ.

Max.

Unit

DC input characteristics
VIL

Low-level input voltage (Schmitt buffer)

-

-

-

0.3 * VDD

V

VIH

High-level input voltage (Schmitt buffer)

-

0.7 * VDD

-

-

V

DC output characteristics
VOL

Low-level output voltage

-

-

0.2

V

VOH

High-level output voltage

VDD - 0.2

-

-

V

Table 5. Operating temperature range
CTRL0 (17h)
Default gain mode
Wide mode

Operating temperature range

∆Temp = Tamb_room – Tamb_sensor

-40 ~ 85 °C

± 2 °C

10 ~ 40 °C

± 10 °C

-40 ~ 85 °C

-90 ~ 50 °C

Considering IR radiation measurement methodology, the output signal of TMOS is sensitive to temperature
differences between the ambient temperature of the sensor itself and the ambient temperature of the room where
the sensor takes the measurement. This delta of temperature could impact the operating temperature of the
sensor. Depending on the target application, the user can select different gain modes to cover the proper range of
the operating temperature and the delta of the temperature between the ambient temperature of the room and the
ambient temperature of the sensor as described in Table 5.
The gain mode can be selected in the gain mode register (CTRL0 (17h)) when the device is in power-down mode.
Note that this register restores its default value whenever the boot/reboot procedure is performed, so the user
needs to set wide mode whenever the device is turned on in case the application needs to cover a broad
operating temperature range and the delta between the temperature of the room in which the object is located
and the temperature of the environment in thermal coupling with the sensor (in other words, the temperature
inside the application).

DS13916 - Rev 2

page 6/40

STHS34PF80
Communication interface characteristics

3.1
3.1.1

Communication interface characteristics
SPI - serial peripheral interface
Subject to general operating conditions for VDD and TOP.
Table 6. SPI slave timing values
Symbol

Parameter

Value(1)
Min

Typ

Max

fc(SPC)

SPI clock frequency

tc(SPC)

SPI clock period

100

thigh(SPC)

SPI clock high

45

tlow(SPC)

SPI clock low

45

CS setup time (mode 3)

5

CS setup time (mode 0)

20

CS hold time (mode 3)

40

CS hold time (mode 0)

20

tsu(SI)

SDI input setup time

15

th(SI)

SDI input hold time

15

tv(SO)

SDO valid output time

50

SDO output disable time

50

Bus capacitance

100

tsu(CS)

th(CS)

tdis(SO)
Cload

10

Unit
MHz

ns

pF

1. Values are evaluated at 10 MHz clock frequency for SPI with 3 wires, based on characterization results, not tested in
production.

Figure 3. SPI slave timing diagram

Note:

DS13916 - Rev 2

Measurement points are done at 0.3·VDD and 0.7·VDD for both ports.

page 7/40

STHS34PF80
Communication interface characteristics

3.1.2

I²C - inter-IC control interface
Subject to general operating conditions for VDD and TOP.
Table 7. I²C slave timing values
Symbol
f(SCL)

I²C fast mode(1)(2)

Parameter
SCL clock frequency

I²C fast mode plus(1)(2)

Min

Max

Min

Max

0

400

0

1000

tw(SCLL)

SCL clock low time

1.3

0.5

tw(SCLH)

SCL clock high time

0.6

0.26

tsu(SDA)

SDA setup time

100

50

th(SDA)

SDA data hold time

0

0.9

START/REPEATED START condition hold time

0.6

0.26

tsu(SR)

REPEATED START condition setup time

0.6

0.26

tsu(SP)

STOP condition setup time

0.6

0.26

Bus free time between STOP and START condition

1.3

0.5

CB

kHz
µs
ns

0

th(ST)

tw(SP:SR)

Unit

µs

Data valid time

0.9

0.45

Data valid acknowledge time

0.9

0.45

Capacitive load for each bus line

400

550

pF

1. Data based on standard I²C protocol requirement, not tested in production.
2. Data for I²C fast mode and I²C fast mode plus have been evaluated by characterization, not tested in production

Figure 4. I²C slave timing diagram
REPEATED
START
START

tsu(SR)
tw(SP:SR)

SDA

tsu(SDA)

START

th(SDA)

tsu(SP)

STOP

SCL

th(ST)

Note:

DS13916 - Rev 2

tw(SCLL)

tw(SCLH)

Measurement points are done at 0.3·VDD and 0.7·VDD for both ports.

page 8/40

STHS34PF80
Absolute maximum ratings

3.2

Absolute maximum ratings
Stress above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device under these conditions is not implied. Exposure to
maximum rating conditions for extended periods may affect device reliability.
Table 8. Absolute maximum ratings
Symbol
VDD
Vin

Note:

Ratings
Supply voltage
Input voltage on any control pin

TSTG

Storage temperature range

ESD

Electrostatic discharge protection

Maximum value

Unit

-0.3 to 4.8

V

-0.3 to VDD+0.3

V

-40 to +125

°C

2 (HBM)

kV

Supply voltage on any pin should never exceed 4.8 V.
This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part.

This device is sensitive to electrostatic discharge (ESD), improper handling can cause permanent damage to the part.

DS13916 - Rev 2

page 9/40

STHS34PF80
Optical specifications

4

Optical specifications
Table 9. Optical specification
Symbol
FFOV

Parameter

Test condition

Full field of view

Min.

Typ. (1)

At 50% intensity

80

Max.

Unit
Degree

1. Typical specifications are not guaranteed.

Figure 5. Typical field of view measurements

Figure 6. Filter transmittance typical curve

DS13916 - Rev 2

page 10/40

STHS34PF80
Digital interfaces

5

Digital interfaces
The registers embedded inside the STHS34PF80 can be accessed through both an I²C and a 3-wire SPI slave
interface.
The serial interfaces are mapped to the same pins. The selection between the two interfaces is made through the
CS pin, refer to Table 1. Pin description.

5.1

I²C interface
Following the correct protocols, the device behaves as an I²C slave. The registers embedded inside the ASIC
device may be accessed through the I²C serial interfaces.
There are two signals associated with the I²C bus: the serial clock line (SCL) and the serial data line (SDA). The
latter is a bidirectional line used for sending and receiving the data to/from the interface. Both the lines must be
connected to VDD through an external pull-up resistor. When the bus is free, both the lines are high.
All transactions begin with a start (ST) and are terminated by a stop (SP) (see Figure 7). A high to low transition
on the SDA line while SCL is high defines a start condition (ST). A low to high transition on the SDA line while
SCL is high defines a stop condition.
Figure 7. Start and stop conditions

After the ST signal has been transmitted by the master, the bus is considered busy. The next byte of data
transmitted after the ST condition contains the address of the slave in the first 7 bits (SAD) and the eighth bit is W
= 0 which indicates that the master is transmitting data to the slave (SAD+W). When a slave address (SAD) is
sent, each device in the system compares the first seven bits after a start condition (ST) with its slave address. If
they match, the device considers itself addressed by the master.
The slave address of the STHS34PF80 is SAD=1011010.
Data transfer with acknowledge is mandatory. The transmitter must release the SDA line during the acknowledge
pulse. The receiver must then pull the data line low so that it remains stable low during the high period of the
acknowledge clock pulse (SAK). A receiver which has been addressed must generate an acknowledge after each
byte of data has been received.
After the SAK from slave (STHS34PF80) the master sends an 8-bit subaddress (SUB): the 7 LSB represent the
actual register address while the MSB has no meaning. For this I²C the auto increment is always active. Since
auto increment is enabled by default, the SUB (register address) is automatically incremented to allow multiple
data read/write at increasing addresses. When the slave receives the subaddress it responds with an ACK.
After this SAK from the slave, the master can do a write (single or multiple) or a read (single or multiple).
When the master wants to write, it sends a DATA (8-bit) and the slave responds with SAK. At this point if the
master wants to close the communication, it sends a stop condition (SP) otherwise, it sends a new DATA.
When the master wants to read, it sends a repeated start condition (SR) and resends the slave address (SAD)
with a read bit (R = 1) (SAD+R). The slave responds with a SAK and sends the DATA (8-bit) to the master to read.
The master responds with a MAK (master acknowledge) if it wants to read from the next SUB address, otherwise
it responds with a NMAK (no master acknowledge) and closes the communication, sending a stop condition (SP).

DS13916 - Rev 2

page 11/40

STHS34PF80
I²C interface

5.1.1

I²C read and write sequences
The previous sequences are used to perform actual write and read sequences described in the following tables.
Table 10. Transfer when the master is writing one byte to slave
Master

ST

SAD+W

SUB

Slave

DATA

SAK

SP

SAK

SAK

Table 11. Transfer when master is writing multiple bytes to slave
Master

ST

SAD+W

SUB

Slave

SAK

DATA

DATA

SAK

SAK

SP
SAK

Table 12. Transfer when master is receiving (reading) one byte of data from slave
Master

ST

SAD+W

Slave

SUB
SAK

SR

SAD+R

SAK

NMAK
SAK

SP

DATA

Table 13. Transfer when master is receiving (reading) multiple bytes of data from slave
Master
Slave

DS13916 - Rev 2

ST

SAD+W

SUB
SAK

SR
SAK

SAD+R

MAK
SAK

DATA

MAK
DATA

NMAK

SP

DATA

page 12/40

STHS34PF80
SPI interface

5.2

SPI interface
The ASIC SPI is a bus slave. The SPI allows writing and read the registers of the device.
The serial interface interacts with the application using 3 wires: CS, SPC, SDI/O.

5.2.1

SPI write
Figure 8. SPI write protocol

The SPI write command is performed with 16 clock pulses. A multiple byte write command is performed by adding
blocks of 8 clock pulses to the previous one.
bit 0: WRITE bit. The value is 0.
bit 1 -7: address AD(6:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written inside the device (MSb first).
bit 16-... : data DI(...-8). Additional data in multiple byte writes.
Figure 9. Multiple byte SPI write protocol (2-byte example)

DS13916 - Rev 2

page 13/40

STHS34PF80
SPI interface

5.2.2

SPI read
Figure 10. SPI read protocol in 3-wire mode

The SPI read command is performed with 16 clocks pulses:
bit 0: READ bit. The value is 1.
bit 1-7: address AD(6:0). This is the address field of the indexed register.
bit 8-15: data DO(7:0) (read mode). This is the data that will be read from the device (MSB first).
The multiple write command is also available in 3-wire mode.

DS13916 - Rev 2

page 14/40

STHS34PF80
Smart digital algorithms

6

Smart digital algorithms
The STHS34PF80 embeds smart digital algorithms to support the following three detection modes. These
embedded smart digital features are supported with default gain mode (CTRL0 (17h) = F1h), but they are not
available when wide mode (CTRL0 (17h) = 81h) is configured.
•
•
•

6.1

Presence detection
Motion detection
Ambient temperature shock detection

Presence detection
Presence detection is performed by observing the difference between the two output signals of each low-pass
filter (LPF_P_M & LPF_P) from the TMOS raw data of TOBJECT.
Then, the difference of the two signals is compared with the two thresholds of PRESENCE_THS and
HYST_PRES which can be configured for the target application. Finally, the presence detection flag signal
(PRES_FLAG) is set when the difference of the two filtered signals exceeds the threshold value as described in
the figure below. When the PRES_FLAG is asserted, the LPF_P output remains at its last value. The LPF_P
starts processing again the input data, providing filtered output when the PRES_FLAG is de-asserted
Figure 11. Block diagram of presence detection algorithm
TPRESENCE

TOBJECT

LPF_P_M
LPF_P

+

ABS

-

FREEZE
PRESENCE_THS
OR
PRESENCE_THS - HYST_PRESENCE

1
0
SEL_ABS

PRES_FLAG

TOGGLE

DS13916 - Rev 2

page 15/40

STHS34PF80
Motion detection

6.2

Motion detection
Motion detection is performed by observing the difference between the two output signals of each low-pass filter
(LPF_P_M & LPF_M) from the TMOS raw data of TOBJECT.
Then, the difference of the two signals is compared with the two thresholds of MOTION_THS and HYST_MOT
which can be configured for the target application. Finally, the motion detection flag signal (MOT_FLAG) is set
when the difference of the two filtered signals exceeds the threshold value as described in the figure below.
Figure 12. Block diagram of motion detection algorithm
TMOTION

TOBJECT

LPF_P_M

+

ABS

-

LPF_M

MOTION_THS
OR
MOTION_THS - HYST_MOTION

MOT_FLAG

TOGGLE

6.3

Ambient temperature shock detection
Ambient temperature shock detection is supported with the output signal of LPF_A_T and the signal of
TAMBIENT. The difference of the two signals is compared with the hysteresis of TAMB_SHOCK_THS and
HYST_TAMBS. The detection of the ambient shock flag (TAMB_SHOCK_FLAG) is set when the difference of the
two signals (LPF_A_T & TAMBIENT) exceeds the threshold values to indicate a sudden change of ambient
temperature.
Figure 13. Block diagram of ambient temperature shock detection algorithm
TAMB_SHOCK

TAMBIENT

LPF_A_T

+

ABS

TAMB_SHOCK_THS
OR
TAMB_SHOCK_THS - HYST_TAMB_SHOCK

TAMB_SHOCK_FLAG

TOGGLE

DS13916 - Rev 2

page 16/40

STHS34PF80
Application schematics

7

Application schematics
The device power supply must be provided through the VDD line, a power supply decoupling capacitor (100 nF)
must be placed as near as possible to the supply pins of device (VDD). Depending on the application, an
additional capacitor of 1 µF could be placed on the VDD line to avoid power noise on VDD.
The functionality of the device and the measured data outputs are selectable and accessible through the I²C and
SPI digital interface as shown in the following figures.
Figure 14. Application schematic with I²C connection

Figure 15. Application schematic with SPI connection

DS13916 - Rev 2

page 17/40

STHS34PF80
Application schematics

Table 14. Internal pin status

DS13916 - Rev 2

Pin number

Name

Default pin status

1

SCL / SPC

Default: input without pull-up

2

RES

3

CS

Default: input with pull-up

4

SDA / SDI/O

Default: input without pull-up

5

NC

6

VDD

7

GND

8

GND

9

VDD

10

INT

Default: input without pull-up

page 18/40

STHS34PF80
Soldering guidelines

8

Soldering guidelines
The soldering profile depends on the number, size and placement of components on the application board. For
this reason, it is not possible to define a unique soldering profile for the sensor only. The customer should use a
time and temperature reflow profile based on PCB design and manufacturing expertise. In any case, the soldering
profile should not exceed profiles as specified in Jedec J-STD-020.
LGA packages show metal traces on the side of the package so solder material must be avoided on the side of
package during reflow.
The product package is not sealed as there is a 0.1 mm hole on the bottom of the package as illustrated in
Figure 17. OLGA-10L (3.2 x 4.2 x 1.455 mm) package outline and mechanical data. A dry reflow process such as
convection reflow is recommended. Vapor phase reflow is not suitable for this type of optical component.
A "no-wash" assembly process has to be used. “Self-cleaning” / “no flux” solder paste are to be used.
The product top surface can be eventually protected by suitable tape during reflow and other manufacturing steps
to avoid contamination or scratches on the optical filter section of the component.
Any residual material (such as water, dust, or any contamination on top of the optical window) causes lower
sensitivity of the IR measurment.
For land pattern and soldering recommendations, consult technical note TN0018 available on www.st.com.

DS13916 - Rev 2

page 19/40

STHS34PF80
Register mapping

9

Register mapping
Table 15. Register map
Name

Type

Reserved

Register address

Default

00h - 0Bh

Reserved

LPF1

RW

0Ch

04h

LPF2

RW

0Dh

22h

Reserved

0Eh

Reserved

WHO_AM_I

R

0Fh

D3h

AVG_TRIM

RW

10h

03h

Reserved
CTRL0

11h - 16h
RW

Reserved
SENS_DATA

17h

Reserved

F1h
Reserved

1Dh
1Eh - 1Fh

Reserved

CTRL1

RW

20h

00h

CTRL2

RW

21h

00h

CTRL3

RW

22h

00h

R

23h

STATUS
Reserved

Who am I

Reserved

18h - 1Ch
RW

Function and comment

24h

FUNC_STATUS

R

25h

TOBJECT_L

R

26h

TOBJECT_H

R

27h

TAMBIENT_L

R

28h

TAMBIENT_H

R

29h

TOBJ_COMP_L

R

38h

TOBJ_COMP_H

R

39h

TPRESENCE_L

R

3Ah

TPRESENCE_H

R

3Bh

TMOTION_L

R

3Ch

TMOTION_H

R

3Dh

TAMB_SHOCK_L

R

3Eh

TAMB_SHOCK_H

R

3Fh

Interrupt control

Reserved

Reserved registers must not be changed. Writing to those registers may cause permanent damage to the device.

DS13916 - Rev 2

page 20/40

STHS34PF80
Embedded functions page register mapping

9.1

Embedded functions page register mapping
Table 16. Embedded functions page register map
Name

DS13916 - Rev 2

Type

Register address

Default

PRESENCE_THS

RW

20h - 21h

C8h

MOTION_THS

RW

22h - 23h

C8h

TAMB_SHOCK_THS

RW

24h - 25h

0Ah

HYST_MOTION

RW

26h

32h

HYST_PRESENCE

RW

27h

32h

ALGO_CONFIG

RW

28h

00h

HYST_TAMB_SHOCK

RW

29h

02h

RESET_ALGO

RW

2Ah

00h

Function and comment

page 21/40

STHS34PF80
Registers description

10

Registers description

10.1

LPF1 (0Ch)
RW – default = 04h
7

6

5

4

3

2

1

0

-

-

LPF_P_M2

LPF_P_M1

LPF_P_M0

LPF_M2

LPF_M1

LPF_M0

LPF_P_M[2:0]

Low-pass filter configuration for motion and presence detection, see Table 17.

LPF_M[2:0]

Low-pass filter configuration for motion detection, see Table 17.

Table 17. Low-pass filter configuration

10.2

LPF_P_M[2:0] / LPF_M[2:0] / LPF_P[2:0] / LPF_A_T[2:0]

Low-pass filter configuration

000

ODR/9

001

ODR/20

010

ODR/50

011

ODR/100

100

ODR/200

101

ODR/400

110

ODR/800

LPF2 (0Dh)
RW – default = 22h
7

6

5

4

3

2

1

0

-

-

LPF_P2

LPF_P1

LPF_P0

LPF_A_T2

LPF_A_T1

LPF_A_T0

LPF_P[2:0]

Low-pass filter configuration for presence detection, see Table 17.

LPF_A_T[2:0]

Low-pass filter configuration for ambient temperature shock detection, see Table 17.

10.3

WHO_AM_I (0Fh)
Read only – default = D3h
7

6

5

4

3

2

1

0

1

1

0

1

0

0

1

1

WHO_AM_I

DS13916 - Rev 2

Device identification – Who am I

page 22/40

STHS34PF80
AVG_TRIM (10h)

10.4

AVG_TRIM (10h)
RW – default = 03h
7

6

5

4

3

2

1

0

0

0

AVG_T1

AVG_T0

0

AVG_TMOS2

AVG_TMOS1

AVG_TMOS0

AVG_T[1:0]

Select the number of averaged samples for ambient temperature, see Table 18.

AVG_TMOS[2:0]

Select the number of averaged samples for object temperature, see Table 19.

Table 18. Averaging selection for ambient temperature
AVG_T[1:0]

Number of averaged samples for ambient temperature

00

8 (default)

01

4

10

2

11

1

Table 19. Averaging selection for object temperature and noise

DS13916 - Rev 2

AVG_TMOS [2:0]

Number of averaged samples for object temperature

RMS noise (LSBrms)

000

2

90

001

8

50

010

32

25

011

128 (default)

20

100

256

15

101

512

12

110

1024

11

111

2048

10

page 23/40

STHS34PF80
CTRL0 (17h)

10.5

CTRL0 (17h)
RW – default = F1h
7

6

5

4

3

2

1

0

1

GAIN2

GAIN1

GAIN0

0

0

0

1

Enables the device to cover a wide operating temperature range for applications that might be thermally heated inside of the
GAIN[2:0] application.
(000: wide mode; 111: default gain mode)

Refer to the ranges in Table 5. Operating temperature range for the wide mode and default gain modes.

10.6

SENS_DATA (1Dh)
RW – default = 00h
7

6

5

4

3

2

1

0

SENS7

SENS6

SENS5

SENS4

SENS3

SENS2

SENS1

SENS0

SENS[7:0]

Provides the sensitivity value in the embedded linear algorithm for compensating ambient temperature variations in the object
temperature.

This register is written during factory calibration to indicate the sensitivity of the device and this value is used in
the embedded linear algorithm for compensating ambient temperature variations in the object temperature.
If the sensitivity is changed by the optical material (that is, cover material) and the embedded compensation
algorithm is required, the sensitivity data need to be revised accordingly.
Sensitivity can be calculated with the following formula by reading the SENS_DATA (1Dh) register.
Sensitivity = value of 1Dh (signed two's complement) x 16 + 2048

DS13916 - Rev 2

page 24/40

STHS34PF80
CTRL1 (20h)

10.7

CTRL1 (20h)
RW – default = 00h
7

6

5

4

3

2

1

0

0

-

-

BDU

ODR3

ODR2

ODR1

ODR0

BDU

Enables the block data update feature for output registers TOBJECT (26h and 27h) and TAMBIENT (28h and 29h).

ODR[3:0]

Output data rate, refer to Table 20 for ODR configuration

Table 20. ODR configuration
ODR [3:0]

ODR frequency [Hz]

Time [ms]

0000

Power-down mode

-

0001

0.25

4000

0010

0.5

2000

0011

1

1000

0100

2

500

0101

4

250

0110

8

126

0111

15

66.67

1xxx

30

33.33

Refer to AN5867 (Section 3.3 Continuous mode) on www.st.com for the details of entering power-down mode and
changing the ODR in continuous mode.
Device power consumption depends on the AVG_TMOS configuration and continuous mode at different ODRs as
described in the following table.
Table 21. Current consumption at different ODRs and AVG_TMOS setting
AVG_TMOS [2:0]

DS13916 - Rev 2

One-shot mode

Continuous mode – current consumption (μA) vs ODR

Current consumption (μA) @ 1Hz

0.25 Hz

0.5 Hz

1 Hz

2 Hz

4 Hz

8 Hz

15 Hz

30 Hz

000 (2)

3.23

3.2

3.52

4.39

6.58

10.54 18.32

33.45

64.50

001 (8)

3.74

3.27

3.82

4.9

7.23

010 (32)

5

3.6

4.48

6.26

9.58

11.4

20.62

011 (128)

10

4.89

7.07

11.44

19.65 37.25 71.85

100 (256)

16.89

6.55

10.55

18.02

33.1

101 (512)

31.16

10.05

17.45

32.25 59.50

110 (1024)

56.34

16.97

31.3

57.60

111 (2048)

113

30.86

58.97

17.05 30.75

38.3

74.94

59

115.65

65.5

page 25/40

STHS34PF80
CTRL2 (21h)

10.8

CTRL2 (21h)
RW (bit 4: write only) – default = 00h
7

6

5

4

3

2

1

0

BOOT

-

-

FUNC_
CFG_ACCESS

-

0

0

ONE_SHOT

Reboot OTP memory content. Self-clearing upon completion. Default value : 0

BOOT

(0: normal mode; 1: reboot memory content)
Enable access to the registers(1) for embedded functions. Default value : 0

FUNC_CFG_ACCESS

(0 : disable access to the embedded function page; 1: enable access to the embedded function page)
Trigger one-shot acquisition. Self-clearing upon completion. Default value: 0

ONE_SHOT

(0 : idle mode; 1 : new data set is acquired)

1. It is not possible to write or read registers in the main page if this bit is set to 1. In order to go back to the main page, this bit should be
written to 0.

CTRL3 (22h)

10.9

RW – default = 00h
7

6

5

4

3

2

1

0

INT_H_L

PP_OD

INT_MSK2

INT_MSK1

INT_MSK0

INT_LATCHED

IEN1

IEN0

Interrupt active-high & active-low. Default value: 0

INT_H_L

(0: active high; 1: active low)
Push-pull / open-drain selection on the INT pin. Default value: 0

PP_OD

(0: push-pull; 1: open drain)

INT_MSK[2:0]

Interrupt masks for flag of FUNC_STATUS (25h), see Figure 16.

INT_LATCHED
IEN[1:0]

Sets latched mode of DRDY on the INT pin.
(0: pulsed mode on the INT pin; 1: latched mode on the INT pin)
Configures the signal routed to the INT pin, see Table 22.

The DRDY signal on the INT pin is set to either pulsed or latched mode using the INT_LATCHED bit.
If IEN[1:0] = 10 (INT_OR routed to the INT pin), INT_LATCHED must be set to 0.
Figure 16. INT_OR
INT_MSK2
PRES_FLAG

INT_MSK1

INT_OR

MOT_FLAG

INT_MSK0
TAMB_SHOCK_FLAG

 PRES_FLAG , MOT_FLAG, TAMB_SHOCK_FLAG from FUNC_STATUS (25h)
 INT_OR is enabled by IEN[1:0] = “10”

DS13916 - Rev 2

page 26/40

STHS34PF80
STATUS (23h)

Table 22. IEN[1:0] configuration

10.10

IEN[1:0]

INT pin

00

high-Z

01

Data ready (DRDY)

10

INT_OR

STATUS (23h)
Read only – default = 00h

7

6

5

4

3

2

1

0

-

-

-

-

-

DRDY

-

-

Data ready for TAMBIENT, TOBJECT, TAMB_SHOCK, TPRESENCE, TMOTION. This bit is reset to 0 when reading the
DRDY FUNC_STATUS (25h) register.
(0: no set of output data is available; 1: new set of output data is available)

10.11

FUNC_STATUS (25h)
Read only – default = 00h
7

6

5

4

3

2

1

0

-

-

-

-

-

PRES_FLAG

MOT_FLAG

TAMB_
SHOCK_FLAG

PRES_FLAG

Presence detection flag. This bit goes to 1 when there is presence detection. It returns back to 0 when there is no
presence detection. Default value: 0
(0: no presence is detected; 1: presence is detected)

MOT_FLAG

Motion detection flag. This bit goes to 1 when there is motion detection. It returns back to 0 when there is no motion
detection. Default value: 0
(0: no motion is detected; 1: motion is detected)

Ambient temperature shock detection flag. This bit goes to 1 when there is ambient temperature shock detection. It
TAMB_SHOCK_FLAG returns back to 0 when there is no ambient temperature shock detection. Default : 0
(0: no ambient temperature shock is detected; 1: ambient temperature shock is detected)

10.12

TOBJECT_L (26h)
Read only – default = 00h

7

6

5

4

3

2

1

0

TOBJECT7

TOBJECT6

TOBJECT5

TOBJECT4

TOBJECT3

TOBJECT2

TOBJECT1

TOBJECT0

TOBJECT[7:0]

DS13916 - Rev 2

TOBJECT LSB data

page 27/40

STHS34PF80
TOBJECT_H (27h)

10.13

TOBJECT_H (27h)
Read only – default = 00h

7

6

5

4

3

2

1

0

TOBJECT15

TOBJECT14

TOBJECT13

TOBJECT12

TOBJECT11

TOBJECT10

TOBJECT9

TOBJECT8

TOBJECT[15:8]

TOBJECT MSB data

The TOBJECT (object temperature) output value is 16-bit data that represents the amount of infrared radiation
emitted from the objects inside the field of view. It is composed of TOBJECT_H (27h) and TOBJECT_L (28h). The
value is expressed as two's complement.

10.14

TAMBIENT_L (28h)
Read only – default = 00h

7

6

5

4

3

2

1

0

TAMBIENT7

TAMBIENT6

TAMBIENT5

TAMBIENT4

TAMBIENT3

TAMBIENT2

TAMBIENT1

TAMBIENT0

TAMBIENT[7:0]

10.15

Ambient temperature LSB data

TAMBIENT_H (29h)
Read only – default = 00h

7

6

5

4

3

2

1

0

TAMBIENT15

TAMBIENT14

TAMBIENT13

TAMBIENT12

TAMBIENT11

TAMBIENT10

TAMBIENT9

TAMBIENT8

TAMBIENT[15:8]

Ambient temperature MSB data

The TAMBIENT (ambient temperature) output value is 16-bit data that represents the temperature of the
environment in thermal coupling with the sensor. It is composed of TAMBIENT_H (28h) and TAMBIENT_L (29h).
The value is expressed as two's complement and its sensitivity is 100 LSB/°C.

10.16

TOBJ_COMP_L (38h)
Read only – default = 00h

7

6

5

4

3

2

1

0

TOBJ_COMP7

TOBJ_COMP6

TOBJ_COMP5

TOBJ_COMP4

TOBJ_COMP3

TOBJ_COMP2

TOBJ_COMP1

TOBJ_COMP0

TOBJ_COMP[7:0]

DS13916 - Rev 2

Compensated LSB data for object temperature output

page 28/40

STHS34PF80
TOBJ_COMP_H (39h)

10.17

TOBJ_COMP_H (39h)
Read only – default = 00h

7

6

5

4

3

2

1

0

TOBJ_COMP15

TOBJ_COMP14

TOBJ_COMP13

TOBJ_COMP12

TOBJ_COMP11

TOBJ_COMP10

TOBJ_COMP9

TOBJ_COMP8

TOBJ_COMP[15:8]

Compensated MSB data for object temperature output

The TOBJ_COMP output value is 16-bit data that represents the amount of infrared radiation emitted from the
objects inside the field of view compensated through the embedded algorithm for compensating ambient
temperature variations (refer to application note AN5867 on www.st.com for the details of the compensation
algorithm). The output data is composed of TOBJ_COMP_H (39h) and TOBJ_COMP_L (38h). The value is
expressed as two's complement.

10.18

TPRESENCE_L (3Ah)
Read only – default = 00h

7

6

5

4

3

2

1

0

TPRESENCE7

TPRESENCE6

TPRESENCE5

TPRESENCE4

TPRESENCE3

TPRESENCE2

TPRESENCE1

TPRESENCE0

TPRESENCE[7:0]

10.19

Presence detection output using embedded algorithms, LSB data

TPRESENCE_H (3Bh)
Read only – default = 00h

7

6

5

4

3

2

1

0

TPRESENCE15

TPRESENCE14

TPRESENCE13

TPRESENCE12

TPRESENCE11

TPRESENCE10

TPRESENCE9

TPRESENCE8

TPRESENCE[15:8]

Presence detection output using embedded algorithms, MSB data

The TPRESENCE (presence) output value is 16-bit data that contains the presence data. It is composed of
TPRESENCE_H (3Bh) and TPRESENCE_L (3Ah). The value is expressed as two's complement.

10.20

TMOTION_L (3Ch)
Read only – default =00h

7

6

5

4

3

2

1

0

TMOTION 7

TMOTION 6

TMOTION 5

TMOTION 4

TMOTION 3

TMOTION 2

TMOTION 1

TMOTION 0

TMOTION[7:0]

10.21

Motion detection output using embedded algorithms, LSB data

TMOTION_H (3Dh)
Read only – default = 00h

7

6

5

4

3

2

1

0

TMOTION 15

TMOTION 14

TMOTION 13

TMOTION 12

TMOTION 11

TMOTION 10

TMOTION 9

TMOTION 8

TMOTION[15:8]

Motion detection output using embedded algorithms, MSB data

The TMOTION (motion) output value is 16-bit data that contains the motion data. It is composed of TMOTION_H
(3Dh) and TMOTION_L (3Ch). The value is expressed as two's complement.

DS13916 - Rev 2

page 29/40

STHS34PF80
TAMB_SHOCK_L (3Eh)

10.22

TAMB_SHOCK_L (3Eh)
Read only – default = 00h
7

6

5

4

3

2

1

0

TAMB_SHOCK7

TAMB_SHOCK6

TAMB_SHOCK5

TAMB_SHOCK4

TAMB_SHOCK3

TAMB_SHOCK2

TAMB_SHOCK1

TAMB_SHOCK0

TAMB_SHOCK[7:0]

10.23

Ambient shock detection output using embedded algorithms, LSB data

TAMB_SHOCK_H (3Fh)
Read only – default = 00h
7

6

5

4

3

2

1

0

TAMB_SHOCK15

TAMB_SHOCK14

TAMB_SHOCK13

TAMB_SHOCK12

TAMB_SHOCK11

TAMB_SHOCK10

TAMB_SHOCK9

TAMB_SHOCK8

TAMB_SHOCK[15:8]

Ambient shock detection output using embedded algorithms, MSB data

The TAMB_SHOCK (ambient temperature shock) output value is 16-bit data that contains the ambient
temperature shock data. It is composed of TAMB_SHOCK_H (3Fh) and TAMB_SHOCK_L (3Eh). The value is
expressed as two's complement.

DS13916 - Rev 2

page 30/40

STHS34PF80
Embedded functions description

11

Embedded functions description
The following registers are used to configure the embedded functions page. These registers are accessible when
the FUNC_CFG_ACCESS bit in CTRL2 (21h) is set to 1.

11.1

FUNC_CFG_ADDR (08h)
RW – default = 00h
7

6

5

4

3

2

1

0

FUNC_CFG_ADDR[7:0]

FUNC_CFG_ADDR[7:0]

11.2

Address of embedded feature that has to be read or written according to the configuration bits in the PAGE_RW
(11h) register.

FUNC_CFG_DATA (09h)
RW – default = 00h
7

6

5

4

3

2

1

0

FUNC_CFG_DATA[7:0]

FUNC_CFG_DATA[7:0]

11.3

Data byte that is read or written to the address of the page indicated by FUNC_CFG_ADDR (08h) according to the
configuration bit in PAGE_RW (11h).

PAGE_RW (11h)
RW default = 00h
7

6

5

4

3

2

1

0

0

FUNC_CFG
_WRITE

FUNC_CFG
_READ

0

-

-

-

-

FUNC_CFG_WRITE

When set to 1, enables the write procedure for the embedded functions.

FUNC_CFG_READ

When set to 1, enables the read procedure for the embedded functions.

DS13916 - Rev 2

page 31/40

STHS34PF80
Embedded functions registers description

12

Embedded functions registers description
Detailed write and read procedures for the embedded functions registers are explained in application note
AN5867 (refer to sections 2.1.1 and 2.1.2, respectively) on www.st.com.

12.1

PRESENCE_THS (20h - 21h)
Presence threshold for presence detection algorithm. This value is 15-bit unsigned. The default value is 200
(00C8h).
7

6

5

4

3

2

1

0

PRESENCE_THS7

PRESENCE_THS6

PRESENCE_THS5

PRESENCE_THS4

PRESENCE_THS3

PRESENCE_THS2

PRESENCE_THS1

PRESENCE_THS0

15

14

13

12

11

10

9

8

-

PRESENCE_THS14

PRESENCE_THS13

PRESENCE_THS12

PRESENCE_THS11

PRESENCE_THS10

PRESENCE_THS9

PRESENCE_THS8

12.2

MOTION_THS (22h - 23h)
Motion threshold for motion detection algorithm. This value is 15-bit unsigned. The default value is 200 (00C8h).
7

6

5

4

3

2

1

0

MOTION_THS7

MOTION_THS6

MOTION_THS5

MOTION_THS4

MOTION_THS3

MOTION_THS2

MOTION_THS1

MOTION_THS0

15

14

13

12

11

10

9

8

-

MOTION_THS14

MOTION_THS13

MOTION_THS12

MOTION_THS11

MOTION_THS10

MOTION_THS9

MOTION_THS8

12.3

TAMB_SHOCK_THS (24h - 25h)
Ambient temperature shock threshold for Tambient shock detection algorithm. This value is 15-bit unsigned. The
default value is 10 (000Ah).
7

6

5

4

3

2

1

0

TAMB_SHOCK7

TAMB_SHOCK6

TAMB_SHOCK5

TAMB_SHOCK4

TAMB_SHOCK3

TAMB_SHOCK2

TAMB_SHOCK1

TAMB_SHOCK0

15

14

13

12

11

10

9

8

TAMB_SHOCK9

TAMB_SHOCK8

-

12.4

TAMB_SHOCK14 TAMB_SHOCK13 TAMB_SHOCK12 TAMB_SHOCK11 TAMB_SHOCK10

HYST_MOTION (26h)
Hysteresis configuration value for motion detection algorithm. It is an 8-bit unsigned value in the registers. The
default value is 32h.
7

6

5

4

3

2

1

0

HYST_MOTION7

HYST_MOTION6

HYST_MOTION5

HYST_MOTION4

HYST_MOTION3

HYST_MOTION2

HYST_MOTION1

HYST_MOTION0

12.5

HYST_PRESENCE (27h)
Hysteresis configuration value for presence detection algorithm. It is an 8-bit unsigned value in the registers. The
default value is 32h.
7

6

5

4

3

2

1

0

HYST_
PRESENCE7

HYST_
PRESENCE6

HYST_
PRESENCE5

HYST_
PRESENCE4

HYST_
PRESENCE3

HYST_
PRESENCE2

HYST_
PRESENCE1

HYST_
PRESENCE0

DS13916 - Rev 2

page 32/40

STHS34PF80
ALGO_CONFIG (28h)

12.6

ALGO_CONFIG (28h)
Algorithm configuration with 00h default value
7

6

5

4

3

2

1

0

-

-

-

0

INT_PULSED

COMP_TYPE

SEL_ABS

0

When 1, the flags as a result of the algorithms are pulsed (high for ODR defined) on the INT pin. Default value: 0

INT_PULSED

(0: latched mode; 1: pulsed mode)

Enables the embedded linear algorithm for compensating ambient temperature variations in the object temperature. Default
COMP_TYPE value: 0
(0: disabled; 1: enabled)
Selects the absolute value in the presence detection algorithm. Default value: 0

SEL_ABS

(0: ABS is not applied; 1: ABS is applied)

The COMP_TYPE bit can be set to enable the embedded algorithm for compensating ambient temperature
variations in the object temperature under the condition of CTRL0 (17h) GAIN[2:0] = 111. If CTRL0 (17h)
GAIN[2:0] is set as 000, the embedded compensation algorithm is not supported. Note that enabling the
embedded compensation algorithm may cause the signal to have higher RMS noise. For further configuration
guidelines, refer to the application note.

12.7

HYST_TAMB_SHOCK (29h)
Hysteresis configuration value for ambient temperature shock detection algorithm. It is an 8-bit unsigned value in
the registers. The default value is 02h.
7

6

5

4

3

2

1

0

HYST_TAMB_
SHOCK7

HYST_TAMB_
SHOCK6

HYST_TAMB_
SHOCK5

HYST_TAMB_
SHOCK4

HYST_TAMB_
SHOCK3

HYST_TAMB_
SHOCK2

HYST_TAMB_
SHOCK1

HYST_TAMB_
SHOCK0

12.8

RESET_ALGO (2Ah)
RW – default = 00h
7

6

5

4

3

2

1

0

-

-

-

-

-

-

-

ALGO_ENABLE
_RESET

When this bit is set to 1, it executes a reset of the algorithms. Default value: 0
ALGO_ENABLE_RESET

(0 : no reset of algorithms;
1: reset of algorithms)

The ALGO_ENABLE_RESET bit must be set to 1 in power-down mode in order to reset the algorithm properly.
This register allows a reset of the algorithm when relevant parameters (threshold, hysteresis, SEL_ABS, or lowpass filter configuration) are modified.
When the user changes one or more of these parameters, it is necessary to execute a reset operation of the
algorithms before restarting a new measurement.
Refer to AN5867 (Section 7.4 Resetting the algorithm) on www.st.com for the details of the reset procedure.

DS13916 - Rev 2

page 33/40

STHS34PF80
Package information

13

Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

13.1

OLGA-10L 3.2 x 4.2 x 1.455 mm package information
Figure 17. OLGA-10L (3.2 x 4.2 x 1.455 mm) package outline and mechanical data

Dimensions are in millimeter unless otherwise specified.
General Tolerance is +/-0.1mm unless otherwise specified.
OUTER DIMENSIONS
ITEM
Width [W]
Length [L]
Height [H]

DIMENSION [mm]
3.2
4.2
1.455

TOLERANCE [mm]
±0.1
±0.1
MA X
DM00488758_6

DS13916 - Rev 2

page 34/40

STHS34PF80

Revision history
Table 23. Document revision history
Date

Version

25-May-2023

1

Changes
Initial release
Added Table 4. DC characteristics

05-Jul-2023

2

Added Section 3.2 Absolute maximum ratings
Minor textual updates

DS13916 - Rev 2

page 35/40

STHS34PF80
Contents

Contents
1

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

3

Sensor and electrical specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1

3.2

Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1.1

SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.1.2

I²C - inter-IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4

Optical specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

5

Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
5.1

I²C interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.1.1

5.2

6

I²C read and write sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

SPI interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.2.1

SPI write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.2.2

SPI read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Smart digital algorithms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
6.1

Presence detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.2

Motion detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.3

Ambient temperature shock detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

7

Application schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

8

Soldering guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

9

Register mapping. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
9.1

10

Embedded functions page register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Registers description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
10.1

LPF1 (0Ch) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

10.2

LPF2 (0Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

10.3

WHO_AM_I (0Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

10.4

AVG_TRIM (10h). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

10.5

CTRL0 (17h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

10.6

SENS_DATA (1Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

10.7

CTRL1 (20h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

10.8

CTRL2 (21h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

10.9

CTRL3 (22h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

10.10 STATUS (23h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
10.11 FUNC_STATUS (25h). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

DS13916 - Rev 2

page 36/40

STHS34PF80
Contents

10.12 TOBJECT_L (26h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
10.13 TOBJECT_H (27h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
10.14 TAMBIENT_L (28h). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
10.15 TAMBIENT_H (29h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
10.16 TOBJ_COMP_L (38h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
10.17 TOBJ_COMP_H (39h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
10.18 TPRESENCE_L (3Ah) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
10.19 TPRESENCE_H (3Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
10.20 TMOTION_L (3Ch) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
10.21 TMOTION_H (3Dh). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
10.22 TAMB_SHOCK_L (3Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
10.23 TAMB_SHOCK_H (3Fh). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

11

12

13

Embedded functions description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
11.1

FUNC_CFG_ADDR (08h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

11.2

FUNC_CFG_DATA (09h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

11.3

PAGE_RW (11h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Embedded functions registers description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
12.1

PRESENCE_THS (20h - 21h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

12.2

MOTION_THS (22h - 23h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

12.3

TAMB_SHOCK_THS (24h - 25h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

12.4

HYST_MOTION (26h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

12.5

HYST_PRESENCE (27h). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

12.6

ALGO_CONFIG (28h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

12.7

HYST_TAMB_SHOCK (29h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

12.8

RESET_ALGO (2Ah) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
13.1

OLGA-10L 3.2 x 4.2 x 1.455 mm package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
List of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
List of figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

DS13916 - Rev 2

page 37/40

STHS34PF80
List of tables

List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.

Pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sensor specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating temperature range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI slave timing values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I²C slave timing values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Optical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transfer when the master is writing one byte to slave . . . . . . . . . . . . . . . . .
Transfer when master is writing multiple bytes to slave . . . . . . . . . . . . . . . .
Transfer when master is receiving (reading) one byte of data from slave . . . .
Transfer when master is receiving (reading) multiple bytes of data from slave
Internal pin status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Register map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Embedded functions page register map . . . . . . . . . . . . . . . . . . . . . . . . . .
Low-pass filter configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Averaging selection for ambient temperature . . . . . . . . . . . . . . . . . . . . . . .
Averaging selection for object temperature and noise . . . . . . . . . . . . . . . .
ODR configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current consumption at different ODRs and AVG_TMOS setting . . . . . . . . .
IEN[1:0] configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DS13916 - Rev 2

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. 4
. 5
. 5
. 6
. 6
. 7
. 8
. 9
10
12
12
12
12
18
20
21
22
23
23
25
25
27
35

page 38/40

STHS34PF80
List of figures

List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.

DS13916 - Rev 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin configuration (package bottom view) . . . . . . . . . . . . . . . . . . . . . . .
SPI slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I²C slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Typical field of view measurements . . . . . . . . . . . . . . . . . . . . . . . . . . .
Filter transmittance typical curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Start and stop conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Multiple byte SPI write protocol (2-byte example) . . . . . . . . . . . . . . . . .
SPI read protocol in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block diagram of presence detection algorithm . . . . . . . . . . . . . . . . . . .
Block diagram of motion detection algorithm. . . . . . . . . . . . . . . . . . . . .
Block diagram of ambient temperature shock detection algorithm . . . . . .
Application schematic with I²C connection . . . . . . . . . . . . . . . . . . . . . .
Application schematic with SPI connection . . . . . . . . . . . . . . . . . . . . . .
INT_OR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OLGA-10L (3.2 x 4.2 x 1.455 mm) package outline and mechanical data .

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STHS34PF80

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DS13916 - Rev 2

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