Update specs
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A development board to quickly prototype on-device ML products. Scale from prototype to production with a removable system-on-module (SOM).
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Edge TPU Module
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- CPU NXP i.MX 8M SOC (quad Cortex-A53, Cortex-M4F)
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- GPU Integrated GC7000 Lite Graphics
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- ML accelerator Google Edge TPU coprocessor
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- RAM 1 GB LPDDR4
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- Flash memory 8 GB eMMC
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- Wireless Wi-Fi 2x2 MIMO (802.11b/g/n/ac 2.4/5GHz) Bluetooth 4.1
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- Dimensions 48mm x 40mm x 5mm
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### Edge TPU Module
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Baseboard
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- Flash memory MicroSD slot
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- USB Type-C OTG Type-C power Type-A 3.0 host Micro-B serial console
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- LAN Gigabit Ethernet port
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- Audio 3.5mm audio jack (CTIA compliant) Digital PDM microphone (x2) 2.54mm 4-pin terminal for stereo speakers
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- Video HDMI 2.0a (full size) 39-pin FFC connector for MIPI-DSI display (4-lane) 24-pin FFC connector for MIPI-CSI2 camera (4-lane)
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- GPIO 3.3V power rail 40 - 255 ohms programmable impedance ~82 mA max current
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- Power 5V DC (USB Type-C)
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- Dimensions 88 mm x 60 mm x 24mm
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- CPU: NXP i.MX 8M SOC (quad Cortex-A53, Cortex-M4F)
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- GPU: Integrated GC7000 Lite Graphics
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- ML accelerator: Google Edge TPU coprocessor
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- RAM: 1 GB LPDDR4
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- Flash memory: 8 GB eMMC
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- Wireless: Wi-Fi 2x2 MIMO (802.11b/g/n/ac 2.4/5 GHz) Bluetooth 4.1
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- Dimensions: 48 mm x 40 mm x 5 mm
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### Baseboard
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- Flash memory MicroSD slot
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- USB: USB-C OTG, USB-C power, Type-A 3.0 host, Micro-B serial console
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- LAN: Gigabit Ethernet port
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- Audio: 3.5 mm audio jack (CTIA compliant) Digital PDM microphone (x2) 2.54 mm 4-pin terminal for stereo speakers
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- Video: HDMI 2.0a (full size) 39-pin FFC connector for MIPI-DSI display (4-lane) 24-pin FFC connector for MIPI-CSI2 camera (4-lane)
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- GPIO: 3.3 V power rail 40 - 255 ohm programmable impedance ~82 mA max current
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- Power: 5 V DC (USB-C)
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- Dimensions: 88 mm x 60 mm x 24mm
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## Purchase
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* [Google](https://coral.withgoogle.com/products/dev-board)
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